Capability

Capability
Category Capability
Layers Double-Side, Multi-Layer (HDI),Aluminum pcb,Flexible
Material Types FR4,CEM1,CEM3,High-Tg,Halogen free,Rogers,Isoloa,Taconic,Arlon,Teflon,Aluminum based.
Max.Panel Dimension 635mm X 1200 mm (25″ X 47″)
Board Thickness 0.2mm-6.0mm
Board Thickness Tolerance ±10%
Minimum Track Width 0.075mm
Minimum Track Space 0.075mm
External Cu Thickness 18um-210um（HOZ-6OZ）
Internal Cu Thickness 18um-210um（HOZ-6OZ）
Drilling Bit Size(CNC) 0.15mm-6.50mm
Finished Hole Dimension 0.1mm-6.0mm
Hole Tolerance ±0.05mm
Hole Position Tolerance ±0.05mm
Laser Drilling Hole Size 0.075mm
Aspect Ration 10:1
Solder Mask Green，Blue，White，Black，Red，Yellow，Purple，ect.
Min Solder Mask Bridge 0.050mm
Plugged Hole Diameter 0.20mm-0.50mm
Impedance Control ±10%
Surface Finishing HASL,HASL(lead Free)，Immersion Gold，Immersion Tin，Immersion Silver，OSP, Hard Gold（up to 100u”）